ChipInsight enables reliable, fast 2D contours for OPC model building, calibration and validation using real wafer print contours. Using reliable 2D contours, yields more and better data, and significantly reduces CD-SEM data collection time. With more RET and assist features being added, discerning when assist features print is more and more important. ChipInsight 2D contours reliably identify the good, and the bad (and the ugly) feature printing results.
With ChipInsight, the explosion in 1D data collection for new OPC models is avoided, and, along with it, time-consuming manual data. Model building and calibration can be started sooner, with less CD-SEM capacity required. OPC model validation can proceed with 2D contours as well. The proprietary edge detection and XFOV technologies in ChipInsight are a giant step forward from using 1D data and single-image validation and/or model-only checks.
With ChipInsight, after taking CDSEMs of the critical 2D features, GDSII data is imported and used to identify hotspots/mismatches with the design intent, so modules can be checked and mask patterns corrected quickly and accurately.
ChipInsight's powerful image-based system processes, creates and analyzes one or multiple layers of aligned and stitched SEM image arrays using a High-Performance Image Analysis Server Platform. ChipInsight uses parallel computing with multi-core architecture, and supports image arrays of essentially unlimited size.
ChipInsight enables image-based analysis of large areas at full resolution with immediate access by multiple users via the web interface. Every feature is available for review and analysis by everyone. ChipInsight can read images from all major CD-SEM manufactures.
- Reliable 2D contours for OPC model data collection
- 2D OPC validation
- 2D OPC model correction
- 3D circuit model creation
- Failure Analysis
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